Packaging of fiber-coupled module for Josephson junction array voltage standards
Kieler O., Malmbekk H., Tuan Nguyen T.A., Bardalen E., Ohlckers P.Optical fibers, Photodiodes, Silicon, Cryogenics, Bonding, Stress, Flip-chip devices
| Document type | Article |
| Journal title / Source | 2016 Conference on Precision Electromagnetic Measurements (CPEM 2016) |
| Publisher's name | IEEE |
| Publication date | 2016-7 |
| DOI | 10.1109/CPEM.2016.7540561 |
| Language | English |